Writes Business Week on the next generation of semiconductor technology: “The new wafers measure 300 millimeters (12 inches) across, which may not seem like much of a jump from today’s 200-mm (8-in.) wafers. But the 50% increase in diameter yields 2.25 times as much surface area for etching chips, yet costs only about 20% more to process. That will help ensure a continuing drop in chip prices for years to come–affecting prices for everything that depends on silicon.”
New Chips
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